Panasonic NPM

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NPM-W2

 

 

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    Specifications
    Model ID
    NPM-W2
    Rear head
    Front head
    Lightweight
    16-nozzle head
    12-nozzle head
    Lightweight
    8-nozzle head
    3-nozzle head V2
    Dispensing head
    No head
    Lightweight 16-nozzle head
    NM-EJM7D
    NM-EJM7D-MD
    NM-EJM7D
    12-nozzle head
    Lightweight 8-nozzle head
    3-nozzle head V2
    Dispensing head
    NM-EJM7D-MD
    -
    NM-EJM7D-D
    Inspection head
    NM-EJM7D-MA
    NM-EJM7D-A
    No head
    NM-EJM7D
    NM-EJM7D-D
    -
    PCB
    dimensions
    (mm)
    Single-lane*1 Batch
    mounting
    L 50 x W 50 ~ L 750 x W 550
    2-positin
    mounting
    L 50 x W 50 ~ L 350 x W 550
    Dual-lane*1 Dual transfer (Batch) L 50 × W 50 ~ L 750 × W 260
    Dual transfer (2-positin) L 50 × W 50 ~ L 350 × W 260
    Single transfer (Batch) L 50 × W 50 ~ L 750 × W 510
    Single transfer (2-positin) L 50 × W 50 ~ L 350 × W 510
    Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA
    Pneumatic source *2 0.5 MPa, 200 L /min (A.N.R.)
    Dimensions *2 (mm) W 1 280*3 × D 2 332 *4 × H 1 444 *5
    Mass 2 470 kg (Only for main body : This differs depending on the option configuration.)
    Placement head Lightweight 16-nozzle head
    (Per head)
    12-nozzle head
    (Per head)
    Lightweight 8-nozzle head
    (Per head)
    3-nozzle head V2
    (Per head)
    High production mode
    [ON]
    High production mode
    [OFF]
    High production mode
    [ON]
    High production mode
    [OFF]
    Max. speed 38 500cph
    (0.094 s/ chip)
    35 000cph
    (0.103 s/ chip)
    32 250cph
    (0.112 s/ chip)
    31 250cph
    (0.115 s/ chip)
    20 800cph
    (0.173 s/ chip)
    8 320cph
    (0.433 s/ chip)
    6 500cph
    (0.554 s/ QFP)
    Placement accuracy
    (Cpk1)
    ±40 μm / chip ±30 μm / chip
    (±25μm / chip)*6
    ±40 μm / chip ±30 μm / chip ± 30 µm/chip
    ± 30 µm/QFP
    12mm
    to 32mm
    ± 50 µm/QFP
    12mm Under
    ± 30 µm/QFP
    Component
    dimensions
    (mm)
    0402*7 chip ~ L 6 x W 6 x T 3 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 0402*7 chip ~ L 12 x W 12 x T 6.5 0402*7 chip ~ L 32 x W 32 x T 12 0603 chip to L 150 x W 25 (diagonal152) x T 30
    Component
    supply
    Taping Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 4 to 56 mm Tape : 4 to 56 / 72 / 88 / 104 mm
    Max.120 (Tape: 4, 8 mm) Front/rear feeder cart specifications : Max.120
    ( Tape width and feeder are subject to the conditions on the left)
    Single tray specifications : Max.86
    ( Tape width and feeder are subject to the conditions on the left)
    Twin tray specifications : Max.60
    ( Tape width and feeder are subject to the conditions on the left)
    Stick - Front/rear feeder cart specifications :
    Max.30 (Single stick feeder)
    Single tray specifications :
    Max.21 (Single stick feeder)
    Twin tray specifications :
    Max.15 (Single stick feeder)
    Tray - Single tray specifications : Max.20
    Twin tray specifications : Max.40
    Dispensing head Dot dispensing Draw dispensing
    Dispensing speed 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) 4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9
    Adhesive position accuracy (Cpk1) ± 75 μ m /dot ± 100 μ m /component
    Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP BGA, CSP
    Inspection head 2D inspection head (A) 2D inspection head (B)
    Resolution 18 µm 9 µm
    View size (mm) 44.4 x 37.2 21.1 x 17.6
    Inspection
    processing
    time
    Solder
    Inspection *10
    0.35s/ View size
    Component
    Inspection *10
    0.5s/ View size
    Inspection
    object
    Solder
    Inspection *10
    Chip component : 100 μm × 150 μm or more (0603 or more)
    Package component : φ150 μm or more
    Chip component : 80 μm × 120 μm or more (0402 or more)
    Package component : φ120 μm or more
    Component
    Inspection *10
    Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11
    Inspection
    items
    Solder
    Inspection *10
    Oozing, blur, misalignment, abnormal shape, bridging
    Component
    Inspection *10
    Missing, shift, flipping, polarity, foreign object inspection *12
    Inspection position accuracy *13
    ( Cpk1)
    ± 20 μm ± 10 μm
    No. of
    inspection
    Solder
    Inspection *10
    Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
    Component
    Inspection *10
    Max. 10 000 pcs./machine
    *1 : Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM.
    *2 : Only for main body
    *3 : 1 880 mm in width if extension conveyors (300 mm) are placed on both sides.
    *4 : Dimension D including tray feeder : 2 570 mm
    Dimension D including feeder cart : 2 465 mm
    *5 : Excluding the monitor, signal tower and ceiling fan cover.
    *6 : ±25 μm placement support option.(Under conditions specified by PSFS)
    *7 : The 03015/0402 chip requires a specific nozzle/feeder.
    *8 : Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip)
    *9 : A PCB height measurement time of 0.5s is included.
    *10 : One head cannot handle solder inspection and component inspection at the same time.
    *11 : Please refer to the specification booklet for details.
    *12 : Foreign object is available to chip components.(Excluding 03015 mm chip)
    *13 : This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

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