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Model ID NPM-W2Rear headFront headLightweight
16-nozzle head12-nozzle headLightweight
8-nozzle head3-nozzle head V2Dispensing headNo headLightweight 16-nozzle head NM-EJM7DNM-EJM7D-MDNM-EJM7D12-nozzle head Lightweight 8-nozzle head 3-nozzle head V2 Dispensing head NM-EJM7D-MD-NM-EJM7D-DInspection head NM-EJM7D-MANM-EJM7D-ANo head NM-EJM7DNM-EJM7D-D-PCB
dimensions
(mm)Single-lane*1 Batch
mountingL 50 x W 50 ~ L 750 x W 550 2-positin
mountingL 50 x W 50 ~ L 350 x W 550 Dual-lane*1 Dual transfer (Batch) L 50 × W 50 ~ L 750 × W 260 Dual transfer (2-positin) L 50 × W 50 ~ L 350 × W 260 Single transfer (Batch) L 50 × W 50 ~ L 750 × W 510 Single transfer (2-positin) L 50 × W 50 ~ L 350 × W 510 Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA Pneumatic source *2 0.5 MPa, 200 L /min (A.N.R.) Dimensions *2 (mm) W 1 280*3 × D 2 332 *4 × H 1 444 *5 Mass 2 470 kg (Only for main body : This differs depending on the option configuration.) Placement head Lightweight 16-nozzle head
(Per head)12-nozzle head
(Per head)Lightweight 8-nozzle head
(Per head)3-nozzle head V2
(Per head)High production mode
[ON]High production mode
[OFF]High production mode
[ON]High production mode
[OFF]Max. speed 38 500cph
(0.094 s/ chip)35 000cph
(0.103 s/ chip)32 250cph
(0.112 s/ chip)31 250cph
(0.115 s/ chip)20 800cph
(0.173 s/ chip)8 320cph
(0.433 s/ chip)
6 500cph
(0.554 s/ QFP)Placement accuracy
(Cpk1)±40 μm / chip ±30 μm / chip
(±25μm / chip)*6±40 μm / chip ±30 μm / chip ± 30 µm/chip
± 30 µm/QFP
12mm
to 32mm
± 50 µm/QFP
12mm Under± 30 µm/QFP Component
dimensions
(mm)0402*7 chip ~ L 6 x W 6 x T 3 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 0402*7 chip ~ L 12 x W 12 x T 6.5 0402*7 chip ~ L 32 x W 32 x T 12 0603 chip to L 150 x W 25 (diagonal152) x T 30 Component
supplyTaping Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 4 to 56 mm Tape : 4 to 56 / 72 / 88 / 104 mm Max.120 (Tape: 4, 8 mm) Front/rear feeder cart specifications : Max.120
( Tape width and feeder are subject to the conditions on the left)
Single tray specifications : Max.86
( Tape width and feeder are subject to the conditions on the left)
Twin tray specifications : Max.60
( Tape width and feeder are subject to the conditions on the left)Stick - Front/rear feeder cart specifications :
Max.30 (Single stick feeder)
Single tray specifications :
Max.21 (Single stick feeder)
Twin tray specifications :
Max.15 (Single stick feeder)Tray - Single tray specifications : Max.20
Twin tray specifications : Max.40Dispensing head Dot dispensing Draw dispensing Dispensing speed 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) 4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9 Adhesive position accuracy (Cpk1) ± 75 μ m /dot ± 100 μ m /component Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP BGA, CSP Inspection head 2D inspection head (A) 2D inspection head (B) Resolution 18 µm 9 µm View size (mm) 44.4 x 37.2 21.1 x 17.6 Inspection
processing
timeSolder
Inspection *100.35s/ View size Component
Inspection *100.5s/ View size Inspection
objectSolder
Inspection *10Chip component : 100 μm × 150 μm or more (0603 or more)
Package component : φ150 μm or moreChip component : 80 μm × 120 μm or more (0402 or more)
Package component : φ120 μm or moreComponent
Inspection *10Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 Inspection
itemsSolder
Inspection *10Oozing, blur, misalignment, abnormal shape, bridging Component
Inspection *10Missing, shift, flipping, polarity, foreign object inspection *12 Inspection position accuracy *13
( Cpk1)± 20 μm ± 10 μm No. of
inspectionSolder
Inspection *10Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) Component
Inspection *10Max. 10 000 pcs./machine
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